Mechanic XGSP50 Solder Paste 183°C 42g

Mechanic XGSP50 Solder Paste 183°C 42g. SKU GN-10567. Model code: XGSP50; Capacity: 42g; Grade: Original; Technology: Sn63/Pb37. Mechanic XGSP50 solder paste is an industrial-grade consumable for precision microsoldering, suitable for BGA reballing and SMD/SMT work. Its Sn63/Pb37 alloy provides a stable 183°C melting point, helping achieve uniform melting and reliable electrical and mechanical connections. The Type 4 particle size distribution (20 - 38 µm) is suitable for stencil application on fine-pitch components. The integrated high-activity no-clean flux improves wetting and helps limit oxidation during heating. Its viscosity is optimized for good pad adhesion and clean application. It leaves very low residue after soldering, and the remaining residues are non-corrosive. For a professional finish, cleaning with isopropyl alcohol is recommended. The 42g jar format is suitable for intensive workshop use. Specifications: Sn63/Pb37 alloy, 183°C melting point, 20 - 38 µm particle size (Type 4), 42g net weight, integrated no-clean flux, applications include BGA reballing and SMD/SMT microsoldering. Usage recommendations: store refrigerated between 0°C and 10°C. Before use, leave the jar at room temperature for about 30 minutes and stir gently with a clean spatula. If the paste becomes too dry after opening, do not add alcohol; use a drop of compatible liquid flux to restore viscosity. The component is function tested according to the supplier information. Original OEM part according to the supplier description.