Double-Sided Magnetic BGA Reballing Platform Mechanic MagTin Max 2.0

Double-sided magnetic BGA reballing platform designed for microsoldering, motherboard refurbishment and work on electronic chips such as CPU, NAND, PMIC, Wi-Fi and audio ICs.

The reversible dual-side construction provides different recess depths for proper component positioning, while the N52 permanent magnet system ensures fast stencil-to-chip fixation during paste application and heating.

Made from CNC-machined aluminum alloy, the platform offers high thermal stability, resistance to heat deformation and good resistance to soldering flux and isopropyl alcohol. The stable base supports precise workshop use.

Universal compatibility with magnetic BGA stencils for iPhone, Android and various integrated circuits.