MAANT PI-01 Glue Removal Kit
Professional glue removal and precision scraping kit designed for phone repair workshops, refurbishment centres and micro-soldering labs. The MAANT PI-01 is intended for removing black sealing glue and cured epoxy around BGA chips and logic components on motherboards before reballing or component replacement.
The set includes an ergonomic non-slip anodised aluminium alloy handle and interchangeable precision blades in multiple shapes: flat, bevelled, angled and pointed. The blades are made from a special flexible steel alloy with shape memory and high thermal resistance, suitable for use near hot air flow or a soldering iron.
The low blade thickness and controlled flexibility allow insertion under sensitive components without applying destructive force to copper pads. The screw-tightening chuck provides firm, play-free blade locking for precise microscope work.
It can also be used for removing structural adhesives from frame grooves, lifting OLED/LCD screen gaskets and finely cutting internal adhesive strips while reducing the risk of damaging underlying FPC flex cables.
Technical specifications:
- Handle material: anodised aluminium alloy
- Blade material: heat-resistant flexible steel alloy
- Compatibility: universal
- Handle length: 130 mm
- Handle diameter: 8 mm
- Weight: 35 g
- Type: passive manual tool
- Fixing system: high-precision quick-tightening screw chuck
- Thermal resistance: tolerant to direct high temperatures
