Mechanic Renying 003 Multifunction Disassembly Blades
Mechanic Renying 003 Multifunction Disassembly Blades. SKU GN-11025. Model code: Renying 003; Technology: IPS. High-precision multifunction disassembly blade set for advanced micro-repair work, designed for epoxy resin (underfill) removal, BGA chip lifting, CPU and NAND work, and PCB layer separation. The blades feature a 0.1 mm thickness and are made from elastic alloy steel with shape memory, allowing fine insertion under components while reducing the risk of damaging tracks or pads. The set includes multiple blade shapes for different tasks: hook blades for tracing component edges, wide spatulas for even lifting, and bevelled tips for cleaning adhesive residues. It withstands direct hot air exposure above 400°C and uses a standard handle format for micro-surgery blades.
Compatibility
Universal compatibility for micro-repair and motherboard service work.
Product details
- Exact product identification: SKU GN-11025.
- Model code: Renying 003.
- Technology: IPS.
Choosing this product
- Selecting the exact product identified by SKU GN-11025.
- Comparing the listed compatibility and variant before a business order.
What to check
Only the specifications listed for this product are confirmed by its catalogue entry. Do not assume other compatible models, included accessories or technical specifications. Check current availability on the product page.
Before ordering
Compare the exact model, product code and selected variant with the required item before ordering.
Frequently asked questions
How do I identify this product?
Mechanic Renying 003 Multifunction Disassembly Blades. SKU GN-11025. Model code: Renying 003; Technology: IPS.
What should I check for compatibility?
Universal compatibility for micro-repair and motherboard service work.
Which variant is listed?
Model code: Renying 003; Technology: IPS.
